The tantalum capacitor is made by forming a rectangular parallelopiped from tantalum powder around metallic tantalum wire and sintering this into a solid at more than 1,000 degrees centigrade in vacuum. The particles of powder are about 0.3μm in the most advanced applications and through sintering into a solid, multi-porous material with pores of 1 micron or less is produced. In general, the capacity of a capacitor is larger as the surface area of the electrode becomes larger and the multi-porous material provides a large capacity in ratio to the volume of the material. This multi-porous material is submerged in a liquid and a metal oxide layer is created on the surface. This layer becomes an insulating layer and the multi-porous tantalum assumes the role of the anode. However, a problem here is what to do about the material for the cathode. The cathode material is in the 1 micron pores of the multi-porous material and must cover the majority of the surface of these holes. Legacy tantalum capacitors used manganese dioxide produced by soaking the multi-porous material in liquid manganese nitrate as cathode. However, with this method, there is a clear limit to the extent to which internal resistance may be reduced. On the other hand, a significant characteristic of the NeoCapacitor® of NEC TOKIN Corporation is the use of conductive polymer as cathode material. Conductive polymers gained widespread recognition after Dr. Hideki Shirakawa received the Nobel Prize for Chemistry for 2000 due to his research on this subject and today, use in this type of capacitor is the most common practical application for conductive polymer. Through using this conductive polymer, it has become possible to reduce internal resistance significantly. In fact, while internal resistance was between 60 and 70 milli-ohms in 1994 when the product was first shipped, improvements to conform to the greater speeds realized by semiconductors have subsequently been made and products with reduced internal resistance have been developed at the rate of once every half a year or a year. Today, as an application for the CPU chip set for the most advanced notebook personal computers, products that are adaptable to ranges of 10 milli-ohms or less are being manufactured.